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high-precision assembly equipment for the advanced packaging market; specialist in the field of RFID, Flip Chip, System in Package (SIP), MCM, CMOS, Die Bonding
thin die handling 
www.datacon.at - 2009-02-08
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3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. broadpak produces ...
cavity down  memory stacking  multi chip package  substrate design 
www.broadpak.com - 2009-02-11
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AEMtec ist der führende Anbieter für die Produktion von optischen und elektronischen Multi-Chip-Modulen in Mischtechnologie.
AEMtec  Chip-Size Packaging 
www.aemtec.de - 2009-02-05
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